By Seong H. Kim,Michael T. Dugger,Kash L. Mittal
The e-book is split into 5 components as follows: half 1: figuring out via Continuum conception; half 2: machine Simulation of Interfaces; half three: Adhesion and Friction Measurements; half four: Adhesion in useful purposes; and
Part five: Adhesion Mitigation Strategies.
This compilation constitutes the 1st publication in this vitally important subject within the burgeoning box of MEMS/NEMS. it really is noticeable from the subjects coated during this booklet that bountiful details is contained right here overlaying realizing of floor forces and adhesion in addition to novel how one can mitigate adhesion in MEMS/NEMS.
This publication will be of serious curiosity to a person engaged within the terrific and interesting box of MEMS/NEMS, because it captures the present R&D activity.
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Adhesion Aspects in MEMS/NEMS by Seong H. Kim,Michael T. Dugger,Kash L. Mittal